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(Solved): An array of electronic chips in mounted within a sealed rectangular enclosure, and cooling is implem ...
An array of electronic chips in mounted within a sealed rectangular enclosure, and cooling
is implemented by attaching an aluminum heat sink(k=180(W)/(m)*K). The base of the heat
sink has dimensions of w_(1)=w_(2)=100mm, while the 6 fins are of thickness t=10mm and
pitch S=18mm. The fin length is L_(f)=50mm and the base of the heat sink has a thickness
of L_(b)=10mm. If cooling is implemented by water flow through the heat sink, with u_(\infty )=2
(m)/(s) and T_(\infty )=290K, what is the base temperature Tb of the heat sink when power dissipation
by the chips is P_(elec )=1800W ? The average convection coefficient for surfaces of the fins
and the exposed base may be estimated by assuming parallel flow over a flat plate. Find
water properties which assumes Ts=310k, and T_(-)f=(290+310)/(2)=300k in Table A.6.